Wiresaw slicing is an emerging technology for wafer
production in photovoltaic (PV) and semiconductor industry because of its ability to cut
crystalline and polycrystalline ingots and produce a very thin wafer with a small kerf
loss and high yield. It is being commonly used for the production of Si wafers in PV
industry, and has the potential to find widespread application for ingots with large
diameters and of ceramic materials.
Date revised - 11/11/98