Wiresaw slicing is an emerging technology for wafer production in photovoltaic (PV) and semiconductor industry because of its ability to cut crystalline and polycrystalline ingots and produce a very thin wafer with a small kerf loss and high yield. It is being commonly used for the production of Si wafers in PV industry, and has the potential to find widespread application for ingots with large diameters and of ceramic materials.

 


Date revised - 11/11/98